Invention Application
- Patent Title: METAMATERIAL AND LAMINATE
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Application No.: US18805543Application Date: 2024-08-15
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Publication No.: US20240402597A1Publication Date: 2024-12-05
- Inventor: Yasuyuki SASADA
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2022-030209 20220228,JP2022-116675 20220721
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/09

Abstract:
Provided are a metamaterial including a base material having a dielectric loss tangent of 0.01 or less and a pattern provided on a surface of the base material, in which the pattern is composed of at least one of a conductive material or a material which transits from an insulator to a conductor, and a thermal expansion coefficient of the base material is 80 ppm/K or less; and a laminate including the metamaterial.
Information query
IPC分类: