Invention Application
- Patent Title: MULTILAYER ELECTRONIC COMPONENT
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Application No.: US18635645Application Date: 2024-04-15
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Publication No.: US20240404740A1Publication Date: 2024-12-05
- Inventor: Yusuke Nagai , Takahiro Sato , Hidenobu Umeda , Takeshi Shibayama , Shinichi Sato , Yuya Ishima , Youhei Iida , Mitsuharu Koike , Keito Yasuda , Takato Sasaki
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2023-090004 20230531
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F27/32

Abstract:
A multilayer coil component includes an element body that contains a plurality of metal magnetic particles made of a soft magnetic material, and at least two conductors that are in contact with the element body. Surfaces of the plurality of metal magnetic particles are covered by an oxide film having an insulating property, an insulating portion having an insulating property is formed in at least a part of a surface of at least one conductor of the two conductors in the conductor, and a thickness of the insulating portion is larger than a thickness of the oxide film.
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |