A perforation device for transseptal access system is disclosed. The perforation device includes an electrically conductive core comprising a proximal portion having a proximal portion length, and a distal portion having a distal portion length. The proximal portion is formed from a first material having a first modulus of elasticity, and the distal portion is formed from a second material having a second modulus of elasticity that is lower than the first modulus of elasticity. The perforation device further includes an exposed electrically conductive functional tip at a distal end of the core. Finally, the perforation device also includes an insulation layer over a portion of the core.