Invention Application
- Patent Title: COIL ELECTRONIC COMPONENT
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Application No.: US18634352Application Date: 2024-04-12
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Publication No.: US20250022650A1Publication Date: 2025-01-16
- Inventor: Donghwan Lee , Dong Jin Lee , Soonkwang Kwon , Tae Hyun Kim , Daehyung You
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2023-0089551 20230711
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/26 ; H01F27/29 ; H01F27/30

Abstract:
A coil electronic component may include a magnetic body that has a first surface and a second surface facing each other, a first coil embedded in the magnetic body and wound around a first core, a second coil embedded in the magnetic body and wound around a second core that is spaced apart from the first core, a first external electrode and a second external electrode disposed on the second surface of the magnetic body and connected to the first coil, and a third external electrode and a fourth external electrode disposed on the second surface of the magnetic body and connected to the second coil, and a first distance from the first coil and the second coil to the first surface is larger than a second distance from the first coil and the second coil to the second surface.
Information query