Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
-
Application No.: US18524202Application Date: 2023-11-30
-
Publication No.: US20250022950A1Publication Date: 2025-01-16
- Inventor: Junghee Park , Dae Hwan Chun , Jungyeop Hong , Youngkyun Jung , NackYong Joo
- Applicant: Hyundai Motor Company , Kia Corporation
- Applicant Address: KR Seoul; KR Seoul
- Assignee: Hyundai Motor Company,Kia Corporation
- Current Assignee: Hyundai Motor Company,Kia Corporation
- Current Assignee Address: KR Seoul; KR Seoul
- Priority: KR10-2023-0090824 20230713
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/16 ; H01L29/40 ; H01L29/66

Abstract:
An embodiment semiconductor device includes a conductive region extending in a first direction and a second direction intersecting the first direction and stacked in a third direction intersecting the first direction and the second direction and a termination region at an end of the conductive region in the first direction, wherein the termination region includes an n+ type substrate, an n− type layer disposed on an upper surface of the n+ type substrate and having a plurality of first trenches opening upward in the third direction, and a lower gate runner covering the plurality of first trenches and disposed on an upper surface of the n− type layer.
Information query
IPC分类: