A power amplification device that includes a substrate having a surface; an integrated circuit including a carrier amplifier and a peak amplifier and disposed on the surface; a carrier balun connected to the carrier amplifier; a peak balun connected to the peak amplifier; and a surface mount device disposed on the surface. Each of the carrier amplifier and the peak amplifier is a pair of differential amplifiers. The substrate includes multiple insulating layers arranged in a stacking direction. An electrode to which the surface mount device is soldered is provided on the surface. In a view from the stacking direction, the carrier balun, the electrode, and the peak balun, which are arranged in a second planar direction, are disposed on one side of the integrated circuit in a first planar direction.