A printed circuit board substrate including multiple sets of glass rows. The multiple sets of glass rows include a first set of glass rows, a second set of glass rows, and a third set of glass rows. The first set of glass rows extend in a first direction. The second set of glass rows extend in a second direction that is perpendicular to the first direction. The third set of glass rows extend in a third direction that is parallel to the first direction. The resin holds the multiple sets of glass rows together and to fill pockets between the multiple of sets of glass rows.