Invention Application
- Patent Title: REDUCTION OF RINGING AND INTERMODULATION DISTORTION IN A MEMS DEVICE
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Application No.: US18961732Application Date: 2024-11-27
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Publication No.: US20250091857A1Publication Date: 2025-03-20
- Inventor: Adam Joseph Fruehling
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Main IPC: B81B3/00
- IPC: B81B3/00 ; G02B26/08 ; H01G5/01 ; H01H1/00

Abstract:
Described embodiments include a microelectromechanical system (MEMS) array comprising a first MEMS device that includes a first movable electrostatic plate elastically connected to a first structure, the first movable electrostatic plate having a first mass, a first fixed electrostatic plate, and a first drive circuit having a first drive output coupled to the first fixed electrostatic plate. There is a second MEMS device that includes a second movable electrostatic plate elastically connected to a second structure, the second movable electrostatic plate having a second mass that is different than the first mass, a second fixed electrostatic plate, and a second drive circuit having a second drive output coupled to the second fixed electrostatic plate.
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