Invention Application
- Patent Title: RESIST UNDER-LAYER FOR USE IN A LITHOGRAPHIC APPARATUS
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Application No.: US18724326Application Date: 2022-12-20
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Publication No.: US20250093774A1Publication Date: 2025-03-20
- Inventor: Sander Frederik WUISTER
- Applicant: ASML NETHERLANDS B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML NETHERLANDS B.V.
- Current Assignee: ASML NETHERLANDS B.V.
- Current Assignee Address: NL Veldhoven
- Priority: EP22152243.6 20220119
- International Application: PCT/EP2022/087032 WO 20221220
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/095 ; G03F7/11 ; G03F7/20 ; G03F7/26

Abstract:
A substrate arrangement for use in a lithographic apparatus, the substrate arrangement including: a resist; a photosensitive resist under-layer; and a substrate, wherein an exposure threshold of the resist under-layer is lower than an exposure threshold of the resist. The resist and the resist under-layer may be both photosensitive to EUV radiation.
Information query
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