According to an embodiment, a method for manufacturing a deposition mask may include forming an inorganic film pattern on a silicon substrate, depositing a metal layer on the inorganic film pattern and openings of the inorganic film pattern, etching portions of the metal layer deposited on the openings of the inorganic film pattern, depositing a protective layer on the inorganic film pattern and the openings of the inorganic film pattern, removing the silicon substrate and the inorganic film pattern provided in each cell region, and removing the protective layer.