Invention Application
- Patent Title: PRESSURE SENSOR WITH FLANGE
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Application No.: US18476114Application Date: 2023-09-27
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Publication No.: US20250102391A1Publication Date: 2025-03-27
- Inventor: Luca MAGGI , Marco DEL SARTO , Alex GRITTI
- Applicant: STMicroelectronics International N.V.
- Applicant Address: CH Geneva
- Assignee: STMicroelectronics International N.V.
- Current Assignee: STMicroelectronics International N.V.
- Current Assignee Address: CH Geneva
- Main IPC: G01L19/14
- IPC: G01L19/14 ; G01L19/00 ; G01L19/06

Abstract:
A sensor module includes an organic substrate, a MEMS pressure sensor mounted to the organic substrate, and a unitary lid mounted on the substrate. The unitary lid includes a central elevated portion housing the MEMS pressure sensor, an aperture in the central elevated portion, and a flat flange extending from the central elevated portion to an edge of the organic substrate.
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