Disclosed is a semiconductor package including: a substrate including first and second surfaces opposite to each other, wherein the substrate extends in first and second directions intersecting each other; a first semiconductor chip on the first surface of the substrate; a second semiconductor chip on the first surface of the substrate and spaced apart from the first semiconductor chip in the first direction; and a dam structure at least partially surrounding the first semiconductor chip, wherein the dam structure includes first and second dam structures on the first surface of the substrate and spaced apart from each other in the first direction such that the first semiconductor chip resides therebetween, wherein the first and second dam structures have different heights relative to the first surface of the substrate.