Invention Application
- Patent Title: DISPLAY PANEL AND METHOD FOR PREPARING THE DISPLAY PANEL
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Application No.: US18578711Application Date: 2022-11-30
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Publication No.: US20250126989A1Publication Date: 2025-04-17
- Inventor: Shaopeng LI , Wenze LI , Weiben ZHANG , Jianhua SHU , Peng WANG , Rongkun FAN , Jialin WANG , Bilun ZHANG , Hao DENG , Fei LI
- Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Chengdu, Sichuan; CN Beijing
- Assignee: Chengdu BOE Optoelectronics Technology Co., Ltd.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: Chengdu BOE Optoelectronics Technology Co., Ltd.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Chengdu, Sichuan; CN Beijing
- International Application: PCT/CN2022/135211 WO 20221130
- Main IPC: H10K59/131
- IPC: H10K59/131 ; H10K59/12

Abstract:
The present disclosure provides a display panel and a method for manufacturing the display panel. The display panel includes a display array, a chip and a circuit board. The array substrate includes a display portion and a transition portion, a bending portion and a first bonding portion which are connected in sequence at an end of the display portion. The first bonding portion is bent through the bending portion to a side of the transition portion in a second direction Y. The circuit board includes a body portion and a second bonding portion. A second bonding electrode of the second bonding portion is connected to the first bonding electrode. The first bonding portion has a sticking-out portion at an end of the first bonding electrode connected to the second bonding electrode. The sticking-out portion extends along the first direction X.
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