Invention Application
- Patent Title: TOUGHENED POLYAMIDE
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Application No.: US18687916Application Date: 2021-11-15
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Publication No.: US20250129248A1Publication Date: 2025-04-24
- Inventor: Tao Wang , Hongyu Chen , Xilun Weng , Kainan Zhang , Ming Ming , Wenke Miao , Wuye Ouyang
- Applicant: Dow Global Technologies LLC , Dow Silicones Corporation
- Applicant Address: US MI Midland; US MI Midland
- Assignee: Dow Global Technologies LLC,Dow Silicones Corporation
- Current Assignee: Dow Global Technologies LLC,Dow Silicones Corporation
- Current Assignee Address: US MI Midland; US MI Midland
- International Application: PCT/CN2021/130728 WO 20211115
- Main IPC: C08L77/02
- IPC: C08L77/02 ; C08J3/22 ; C08K5/17
Abstract:
A toughened polyamide composition including a blend of: (A) at least one polyamide; (B) at least one impact modifier; and (C) at least one organic amine; a process for producing the toughened polyamide composition; and articles made from the toughened polyamide compositions.
Information query
