Invention Grant
- Patent Title: Direct current control system
- Patent Title (中): 直流控制系统
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Application No.: US15042050Application Date: 1950-03-18
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Publication No.: US2622239APublication Date: 1952-12-16
- Inventor: MICHAEL BRACUTT
- Applicant: RECONSTRUCTION FINANCE CORP
- Assignee: Reconstruction Finance Corp
- Current Assignee: Reconstruction Finance Corp
- Priority: US15042050 1950-03-18
- Main IPC: H02P7/292
- IPC: H02P7/292
Public/Granted literature
- US09741642B1 Semiconductor package with partial plating on contact side surfaces Public/Granted day:2017-08-22
Information query
