Invention Grant
- Patent Title: Coupling devices
- Patent Title (中): 耦合器件
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Application No.: US83079559Application Date: 1959-07-31
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Publication No.: US3002771APublication Date: 1961-10-03
- Inventor: CHAKROFF RICHARD O
- Applicant: CHAKROFF RICHARD O
- Assignee: Richard O Chakroff
- Current Assignee: Richard O Chakroff
- Priority: US83079559 1959-07-31
- Main IPC: F16L19/028
- IPC: F16L19/028 ; F16L19/03 ; F16L19/04 ; F16L27/113
Information query
IPC分类:
