Invention Grant
- Patent Title: Encapsulation of electronic modules
- Patent Title (中): 封装电子模块
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Application No.: US44533965Application Date: 1965-04-05
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Publication No.: US3340438APublication Date: 1967-09-05
- Inventor: DION REGINALD R , BENENATI JOSEPH A , MORRIS ROBERT E , COUGHLIN CHARLES P
- Applicant: IBM
- Assignee: Ibm
- Current Assignee: Ibm
- Priority: US44533965 1965-04-05
- Main IPC: H01C7/00
- IPC: H01C7/00 ; H01L21/60 ; H01L23/055 ; H01L23/16 ; H01L25/16 ; H01L25/18 ; H01L49/02 ; H05K1/16 ; H05K3/12
Information query
