Invention Grant
- Patent Title: Method and apparatus for applying topping to wafers
- Patent Title (中): 将顶部施加到晶片的方法和装置
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Application No.: US51113165Application Date: 1965-12-02
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Publication No.: US3385237APublication Date: 1968-05-28
- Inventor: BRUNSON BRUCE W , DUFENDACH WILLIAM R
- Applicant: WERNER MACHINERY COMPANY
- Assignee: Werner Machinery Company
- Current Assignee: Werner Machinery Company
- Priority: US51113165 1965-12-02
- Main IPC: A23G3/20
- IPC: A23G3/20
Information query
