A liquid interface diffusion process, for bonding titanium or titanium alloys wherein at least one of the titanium type materials to be fayed is sequentially plated with a total weight of from between 1 and 3 gms/ft2 of at least three selected metals or an alloy made therefrom. The faying surfaces are then held together to maintain position on alignment, placed in a protective atmosphere, the temperature of the materials are then raised at a controlled rate causing sufficient solid state diffusion to occur and a liquid to form continuing to increase the temperature to a pre-determined level and holding at this temperature until a solidification occurs and sufficient additional solid state diffusion occurs producing a desirable dilution of bridge material and titanium at the joint, and then reducing the temperature at a controlled rate to a lower temperature to complete the bonding cycle. An additional step of heat curing under protective atmosphere is required after the bonding of beta type titanium alloys, for providing additional precipitation sites and precipitation of the alpha phase for strengthening of the basis materials.