An apparatus for soldering a wire to a terminal includes a plurality of connector clamps secured to a turntable for positioning each clamped connector adjacent a hot air blower. The hot air blower blows hot air toward a solder ring and heat shrinkable tube surrounding the wire and a corresponding connector terminal for melting the solder and shrinking the tube. The apparatus includes a baffle for redirecting the blown hot air back toward the solder ring and tube assembly for preheating the assembly.