An alkyd-type resin composition comprising a chelate compound represented by the formula ##EQU1## wherein M is a metal of the first transition metal group (except for nickel), lead, or zirconium; Ar.sub.1 and Ar.sub.2 are each an aromatic residue, a substituted aromatic residue, or a heterocyclic aromatic residue; R, R.sub.1 and R.sub.2 are each hydrogen, an alkyl residue, a cycloaliphatic alkyl residue, an aromatic residue, a substituted aromatic residue, or a jointed residue of these radicals, and the carbon chains of R, R.sub.1 and R.sub.2 may contain hetero atoms such as oxygen, nitrogen, or sulfur. The said resin composition is characterized by little change in properties with the lapse of time, accelerated curing, and improved drying characteristics without gel formation in the surface layer of the resin.