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US4025404A Ohmic contacts to thin film circuits 失效
欧姆接触薄膜电路

Ohmic contacts to thin film circuits
摘要:
A process for establishing gold contact studs on thin film circuits consists in localized sublayer deposition of a platinum-gold alloy followed by subsequent electrolytic gold thickening of the studs. The studs so produced are particularly fit for thermocompression interconnection.
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