发明授权
US4066819A Method of bonding gold films to non-electrically conducting oxides and
product thereby obtained
失效
将金膜与非导电氧化物结合的方法和由此得到的产品
- 专利标题： Method of bonding gold films to non-electrically conducting oxides and product thereby obtained
- 专利标题（中）： 将金膜与非导电氧化物结合的方法和由此得到的产品
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申请号： US191292申请日： 1971-10-21
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公开(公告)号： US4066819A公开(公告)日： 1978-01-03
- 发明人: Wallace E. Anderson , Albert M. Syeles , Albert D. Krall
- 申请人： Wallace E. Anderson , Albert M. Syeles , Albert D. Krall
- 申请人地址： DC Washington
- 专利权人： The United States of America as represented by the Secretary of the Navy
- 当前专利权人： The United States of America as represented by the Secretary of the Navy
- 当前专利权人地址： DC Washington
- 主分类号： B32B15/04
- IPC分类号： B32B15/04 ; H05K1/02 ; H05K1/09
摘要：
A microstrip board comprising a gold film which contains about at least 1/2 weight per cent of aluminum bonded to a non-electrical conducting oxide is prepared by simultaneously evaporating the gold and aluminum onto the non-electrical conducting oxide and thereafter optionally heating the film thus formed.
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