Invention Grant
- Patent Title: High current density electrical contact
- Patent Title (中): 高电流密度电接触
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Application No.: US782820Application Date: 1977-03-30
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Publication No.: US4105280APublication Date: 1978-08-08
- Inventor: Lloyd E. Thompson, Jr.
- Applicant: Lloyd E. Thompson, Jr.
- Assignee: Thompson Jr Lloyd E
- Current Assignee: Thompson Jr Lloyd E
- Main IPC: H01H1/38
- IPC: H01H1/38 ; H01R13/187 ; H01R13/53 ; H01R7/06
Abstract:
The disclosure concerns an electrical contact for conducting high current densities in a minimum of space and with improved connection between the contact and the socket. The contact includes a split, internally tapered circular sleeve which is mounted in spring-loaded engagement in a socket. A tapered contact pin conforms to the split sleeve and when inserted causes the sleeve to be wedged between the pin and the socket. The compression spring generates large contact pressures in a relatively short length of connector travel, thus enabling the mechanical advantage of the coupling mechanism to accomplish connector engagement with minimal operator effort.
Public/Granted literature
- US5783451A Pipetting unit and method for liquids Public/Granted day:1998-07-21
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