发明授权
US4109846A Automatic height sensor for semiconductor bonding tool, wafer probe or
the like
失效
用于半导体焊接工具的自动高度传感器，晶片探针等
- 专利标题： Automatic height sensor for semiconductor bonding tool, wafer probe or the like
- 专利标题（中）： 用于半导体焊接工具的自动高度传感器，晶片探针等
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申请号： US797622申请日： 1977-05-17
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公开(公告)号： US4109846A公开(公告)日： 1978-08-29
- 发明人: Matheus D. Pennings , Billy B. Tippin
- 申请人： Matheus D. Pennings , Billy B. Tippin
- 申请人地址： WI Milwaukee
- 专利权人： Sola Basic Industries, Inc.
- 当前专利权人： Sola Basic Industries, Inc.
- 当前专利权人地址： WI Milwaukee
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/68
摘要：
A height sensor is disclosed which permits a tool to sense the height of a semiconductor die, or the like, above a work surface such as a bonding table. A tool arm moves transverse to the work surface and is interconnected to a cam by a second arm. The second arm is disengageable from the first arm and disengages the first arm when the tool contacts the semiconductor die. Sensing means are provided to detect the separation of the two arms.
公开/授权文献
- US5756123A Capsule shell 公开/授权日：1998-05-26
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