发明授权
- 专利标题: Method of making a submicrometer aperture in a substrate
- 专利标题(中): 在基板上制造分子孔的方法
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申请号: US822540申请日: 1977-08-08
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公开(公告)号: US4117301A公开(公告)日: 1978-09-26
- 发明人: Jitendra Goel , Subrahmanyam Yegna Narayan , Ira Drukier
- 申请人: Jitendra Goel , Subrahmanyam Yegna Narayan , Ira Drukier
- 申请人地址: NY New York
- 专利权人: RCA Corporation
- 当前专利权人: RCA Corporation
- 当前专利权人地址: NY New York
- 主分类号: B23K17/00
- IPC分类号: B23K17/00 ; G03F7/00 ; B23K9/00
摘要:
A mask for manufacturing microcircuits is comprised of a substratum and a layer of matter, such as, for example gold, adjacent the substratum. An aperture is located in the layer of matter. The aperture in the layer of matter exhibits a cross-section resembling an inverted isosceles trapezoid. The method for manufacture of the mask comprises the steps of appositioning a patterned layer of photoresist to a layer of gold which is adjacent the substratum. The structure comprising the photoresist, the gold layer and the substratum is exposed to a beam of ions having a preselected kinetic energy such that the ions remove gold exposed by apertures in the photoresist layer. The kinetic energy of the ions is selected such that an aperture is eroded in the layer of gold, the aperture exhibiting an inverted isosceles trapezoidal cross-section.
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