Invention Grant
- Patent Title: Cross-head die with volumetric flow compensation means
- Patent Title (中): 具有体积流量补偿手段的十字头模具
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Application No.: US852228Application Date: 1977-11-17
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Publication No.: US4171195APublication Date: 1979-10-16
- Inventor: Reuben Klein , Imrich Klein , Yigal Cidon
- Applicant: Reuben Klein , Imrich Klein , Yigal Cidon
- Applicant Address: NJ Highland Park
- Assignee: Scientific Process & Research, Inc.
- Current Assignee: Scientific Process & Research, Inc.
- Current Assignee Address: NJ Highland Park
- Main IPC: B29C48/325
- IPC: B29C48/325 ; B29C48/34 ; B29C48/92 ; B29D23/04
Abstract:
A cross-head die in which the manifold is provided with means for selectively varying the volume of the manifold at some locations relative to other locations, whereby the relative wall thickness about the annular configuration of the material flowing through the die is selectively adjusted about the periphery of the annular configuration of flowing material. Wall thickness and configuration are further controlled at the outlet orifice of the die by means movable to selectively expand, contract and alter the annular configuration of the die passage at the orifice.
Public/Granted literature
- US5982082A Field emission display devices Public/Granted day:1999-11-09
Information query
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