发明授权
- 专利标题： Process for bonding with polyethylene encapsulant
- 专利标题（中）： 聚乙烯密封剂粘结工艺
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申请号： US954674申请日： 1978-10-25
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公开(公告)号： US4197270A公开(公告)日： 1980-04-08
- 发明人: Bernard A. Harvey
- 申请人： Bernard A. Harvey
- 申请人地址： DC Washington
- 专利权人： The United States of America as represented by the Secretary of the Navy
- 当前专利权人： The United States of America as represented by the Secretary of the Navy
- 当前专利权人地址： DC Washington
- 主分类号： B05D1/24
- IPC分类号： B05D1/24 ; B05D1/36 ; B29C45/00 ; B29C70/70 ; G01S1/72 ; B29F1/10
摘要：
A process for producing a bond at the interface between an encapsulant andhe object to be encapsulated is provided. A selected resin with curing agent is coated and oven cured on the object to be encapsulated and thereafter a copolymer coating is applied to the assembly in a fluidized bed and the assembly is oven cured. The resulting product is then injection molded with a suitable polyethylene material.
公开/授权文献
- US5341059A Superconducting bearing unit and operating method thereof 公开/授权日：1994-08-23
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