Invention Grant
US4255760A Multiple, superposed-channel color image sensor 失效
多路叠加通道彩色图像传感器

Multiple, superposed-channel color image sensor
Abstract:
A multiple, superposed-channel, solid-state, color image sensor of the "parallel transfer" type includes a plurality of superposed generally "ladder shaped" channels in a semiconductor substrate. One "side rail" of the ladder shape provides the channel structure for a multiple, superposed-channel signal handling device, such as a charge coupled shift register. The "rungs" of the ladder shape provide a plurality of multiple, superposed-channel color image sensing sites, and the other "side rail" of the ladder shape provides a plurality of superposed "anti-bloom" drains, one drain per channel. Electrical contact to a buried channel is provided by a V-groove etching technique. A V-groove extending from the surface of the device into the buried channel provides physical access to the buried channel. A conductor, in ohmic contact with the channel, extends from the bottom of the V-groove to the surface of the device to provide electrical contact with the buried channel.
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