发明授权
- 专利标题: Semiconductor encapsulant for annealing ion-implanted GaAs
- 专利标题(中): 用于退火离子注入GaAs的半导体密封剂
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申请号: US126088申请日: 1980-02-29
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公开(公告)号: US4267014A公开(公告)日: 1981-05-12
- 发明人: John E. Davey , Aristos Christou , Harry B. Dietrich
- 申请人: John E. Davey , Aristos Christou , Harry B. Dietrich
- 申请人地址: DC Washington
- 专利权人: The United States of America as represented by the Secretary of the Navy
- 当前专利权人: The United States of America as represented by the Secretary of the Navy
- 当前专利权人地址: DC Washington
- 主分类号: H01L21/265
- IPC分类号: H01L21/265 ; H01L21/324
摘要:
A method for protecting an ion-implanted substrate during the annealing process by covering the ion-implanted layer with a suitable encapsulant. A thin layer of ions are implanted into a GaAs substrate. A protective layer of germanium, amorphous GaAs, doped GaAs, or GaAlAs is applied over the implanted layer and on the periphery of the ion-implanted GaAs substrate. The composite is annealed at a temperature which is adequate for the lattice to recover from the ion-implantation-induced damage. The protective layer is removed subsequent to the anneal step, without any damage to the ion-implanted layer.
公开/授权文献
- US5659777A Method for intraprocessor communication 公开/授权日:1997-08-19
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