Invention Grant
- Patent Title: Adhesive assembly
- Patent Title (中): 胶粘剂总成
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Application No.: US914003Application Date: 1978-06-09
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Publication No.: US4273827APublication Date: 1981-06-16
- Inventor: Theodore J. Sweeney , John G. Haviland
- Applicant: Theodore J. Sweeney , John G. Haviland
- Applicant Address: MI Detroit
- Assignee: Theodore Sweeney & Company
- Current Assignee: Theodore Sweeney & Company
- Current Assignee Address: MI Detroit
- Main IPC: B60R13/02
- IPC: B60R13/02 ; C09J5/00 ; C09J7/02 ; B32B5/16
Abstract:
Described is an adhesive assembly containing a first adhesive and a second adhesive which is of a different strength or chemical composition than the first adhesive and positioned between the first and second adhesives is a barrier means for preventing contamination of the respective adhesives or the substrates to which they adhere wherein the combination of the adhesives includes a spongy or foam layer. Also described is a method of adhering together a plurality of substrates employing the adhesive assembly.
Public/Granted literature
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