A thermosetting injection molding compound comprising a specific crystalline unsaturated polyester comprising (A) a crystalline unsaturated polyester of terephthalic acid/fumaric acid=5/5-1/9 by mol (acid component) and 1,4-butanediol/other glycol=7/3-10/0 (glycol component) and (B) a styrene type monomer and/or allyl type monomer, and having specific ranges of a viscosity, a melting point and an acid value, said crystalline unsaturated polyester resin being admixed with (C) a glass fiber and (D) other additives in a specific ratio. The thermosetting injection molding compound has no tackiness and has excellent flowability and mold filling properties and can give an excellent molded product having good appearance without flow marks, surge or the like, and hence, the thermosetting injection molding compound of the present invention is particularly suitable for the preparation of electric, electronic and automobile parts which require excellent heat resistance, electrical characteristics and fire retardant properties.