The invention relates to a device for contact free potential measurements of integrated circuits by means of measuring the energy of the secondary electrons released at the measuring location. One collector electrode 16 and one opposing field electrode 18 are arranged in succession at a predetermined distance from the measuring point with the electrodes 16 and 18 being formed as grid electrodes and arranged parallel to the flat surface of the circuit being tested. The secondary electrons are intercepted by a scintillator where their energy can be measured and the device makes it possible to have contact free potential measurements on paths of integrated circuit wafers.