发明授权
- 专利标题: Method for manufacturing a semiconductor device utilizing selective epitaxial growth and post heat treating
- 专利标题(中): 利用选择性外延生长和后热处理制造半导体器件的方法
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申请号: US134673申请日: 1980-03-27
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公开(公告)号: US4329772A公开(公告)日: 1982-05-18
- 发明人: Saburo Oikawa , Susumu Murakami , Yoshio Terasawa
- 申请人: Saburo Oikawa , Susumu Murakami , Yoshio Terasawa
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX54-37034 19790330
- 主分类号: H01L21/20
- IPC分类号: H01L21/20 ; H01L29/10 ; H01L29/739 ; H01L29/744 ; H01L29/80 ; H01L21/223
摘要:
Disclosed is an improved method of growing an epitaxial layer preventing auto-doping from a doped region exposed to a surface of a semiconductor substrate. A surface of a semiconductor substrate of one conductivity type is covered with a mask having a predetermined opening. Then, impurity atoms are doped into the substrate through the opening to form a region of the other conductivity type. An epitaxial layer of one conductivity type is deposited over the exposed surface of the substrate with another mask which covers the entire surface of the region and has an area larger than that of the exposed surface of the region. The latter mask prevents auto-doping from the region of the other conductivity type. The process is usable for controlling, for example, channel widths of field effect semiconductor devices uniformly and precisely.
公开/授权文献
- US5993068A Rolling bearing with a shield plate 公开/授权日:1999-11-30
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