发明授权
- 专利标题： Apparatus for soldering solder on ceramic substrate
- 专利标题（中）： 用于将焊料焊接在陶瓷基板上的装置
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申请号： US177649申请日： 1980-08-13
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公开(公告)号： US4358044A公开(公告)日： 1982-11-09
- 发明人: Hitoshi Igarashi
- 申请人： Hitoshi Igarashi
- 申请人地址： JPX Tokyo
- 专利权人： Asahi Glass Company, Ltd.
- 当前专利权人： Asahi Glass Company, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX54-103401 19790814
- 主分类号： C04B37/00
- IPC分类号： C04B37/00 ; B23K1/06 ; C03C27/04 ; C03C27/08 ; C04B37/02 ; C04B41/88 ; H01L23/50 ; H05K3/00 ; B23K20/10 ; B23K37/02
摘要：
An apparatus for soldering a solder on a difficultly solderable substrate comprises a vibration tip which is rotatably held and is mounted on an ultrasonic oscillation mechanism and is slidably held to the vertical direction to an object for soldering. A needle part is placed in a predetermined distance and a predetermined direction from the edge of said vibration tip and said needle part is projected in substantially the same level as that of said edge of said vibration tip.
公开/授权文献
- US6095345A Electronics rack alignment structures 公开/授权日：2000-08-01
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