发明授权
- 专利标题： Process for producing fire retardant and heat resistant copper-clad laminated board, and varnish therefor
- 专利标题（中）： 制造阻燃和耐热铜包层压板的方法及其清漆
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申请号： US249242申请日： 1981-03-30
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公开(公告)号： US4400438A公开(公告)日： 1983-08-23
- 发明人: Akio Takahashi , Yutaka Itoh , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita , Yutaka Mizuno , Shunya Yokozawa , Kenji Tsukanishi
- 申请人： Akio Takahashi , Yutaka Itoh , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita , Yutaka Mizuno , Shunya Yokozawa , Kenji Tsukanishi
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX55-42405 19800331
- 主分类号： B32B15/04
- IPC分类号： B32B15/04 ; B32B15/08 ; B32B15/088 ; B32B27/04 ; C08J5/24 ; C09D179/08 ; H05K1/03 ; B32B31/12
摘要：
A process for producing a fire retardant and heat resistant copper-clad laminated board, characterized in that a maleimide resin type varnish containing a small amount of a specific halogenated diphenyl ether compound is used for impregnation of base material therewith. Copper-clad laminated boards produced according to the present invention may be so improved in fire or flame retardant properties as to be classed 94 V-0 in accordance with UL 94 (vertical burning test), and, nevertheless, are not substantially downgraded in heat resisting properties as well as copper foil peel strength.
公开/授权文献
- US4883869A Novel beta-lactams containing amino acid substituents 公开/授权日：1989-11-28
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