Invention Grant
- Patent Title: Coupler
- Patent Title (中): 耦合器
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Application No.: US198726Application Date: 1980-10-20
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Publication No.: US4408372APublication Date: 1983-10-11
- Inventor: Teiji Kimura , Shigeru Kimura
- Applicant: Teiji Kimura , Shigeru Kimura
- Applicant Address: JPX Tokyo JPX Yokohama
- Assignee: Sony Corporation,Nifco Inc.
- Current Assignee: Sony Corporation,Nifco Inc.
- Current Assignee Address: JPX Tokyo JPX Yokohama
- Priority: JPX54-146229[U] 19791024
- Main IPC: F16C11/06
- IPC: F16C11/06 ; F16B17/00 ; F16B21/07 ; H04R1/02 ; A44B21/00
Abstract:
A coupler for joining two objects comprises an insertion member attached fast to one of the objects and a reception member attached fast to the other object and used for admitting the insertion member into fast engagement therewith. The insertion member is provided with a setting portion for fast attachment to the aforementioned one object and a shaft extended from the setting portion and possessed of a radially expanded engaging portion at the leading end thereof. The reception member is provided with two generally semicylindrical shells connected to each other through a thin-walled hinge portion and adapted to form one cylindrical shape upon being closed onto each other along the matched edges thereof and a plurality of resilient engaging pieces regularly spaced in the longitudinal direction on the inner wall of each of the shells.
Public/Granted literature
- US5467220A Method and apparatus for improving semiconductor wafer surface temperature uniformity Public/Granted day:1995-11-14
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