The substantial change in modulus with temperature of certain materials, especially memory metals, is used to make a novel connector by forcing a band made from such a material in its low modulus state up an external tapered portion of a tubular coupling member so as to deform the band which remains in position about the coupling member. To make a connection one or more substrates is(are) positioned inside the tubular coupling member and the band is brought to its high modulus state whereupon it contracts and deforms the tubular coupling member and forces it into firm connection with the substrate.