发明授权
- 专利标题: Filling materials for communications cable
- 专利标题(中): 通讯电缆填充材料
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申请号: US423818申请日: 1982-09-27
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公开(公告)号: US4426230A公开(公告)日: 1984-01-17
- 发明人: Lawrence E. Davis , Naren I. Patel
- 申请人: Lawrence E. Davis , Naren I. Patel
- 申请人地址: NC Hickory
- 专利权人: Siecor Corporation
- 当前专利权人: Siecor Corporation
- 当前专利权人地址: NC Hickory
- 主分类号: G02B6/44
- IPC分类号: G02B6/44 ; H01B7/285 ; C08L91/00 ; C08L91/06
摘要:
Disclosed are telephone cable filling materials and telephone cables comprised of a plurality of insulated electrical conductors twisted together to form a core in which there are a multiplicity of interstices between the insulated electrical conductors filled with the cable filler materials. The filling materials are composed of a petrolatum base material and inorganic microspheres and can be divided into two groups: (1) a first group to fill cables used at temperatures below the melting point of the petrolatum and (2) a second group to fill cables that may be used above that temperature. The first group is composed of mixtures of 40 to 90 weight percent petrolatum and 1 to 60 weight percent inorganic hollow (air filled) microspheres. When mixtures from this group are used as a filler in a telephone cable, the filler has a drip point nearly equal to the average melting point of the petrolatum, normally 57.2.degree. C. The second group is composed of two embodiments. The first embodiment comprises 62 to 95 weight percent petrolatum, 1 to 35 weight percent inorganic hollow microspheres, and 1 to 8 weight percent low molecular weight polyethylene dissolved in the petrolatum. The second embodiment comprises 60 to 98 weight percent petrolatum, 1 to 39 weight percent inorganic hollow microspheres and 1 to 15 weight percent of glycerol hydroxy stearate dissolved in the petrolatum. When mixtures from the second group are used as a filler in a telephone cable, drip points ranging from the average melting point of petrolatum to temperatures in excess of 75.degree. C. are observed.
公开/授权文献
- US5575324A Sunshield and method of manufacture of sunshield 公开/授权日:1996-11-19
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