发明授权
- 专利标题: Temperature control for wafer polishing
- 专利标题(中): 晶圆抛光温度控制
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申请号: US299378申请日: 1981-09-04
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公开(公告)号: US4450652A公开(公告)日: 1984-05-29
- 发明人: Robert J. Walsh
- 申请人: Robert J. Walsh
- 申请人地址: MO St. Louis
- 专利权人: Monsanto Company
- 当前专利权人: Monsanto Company
- 当前专利权人地址: MO St. Louis
- 主分类号: H01L21/304
- IPC分类号: H01L21/304 ; B24B37/10 ; B24B49/14 ; H01L21/302 ; B24B7/04
摘要:
A wafer workpiece polishing temperature control method and apparatus are provided wherein wafers are mounted upon a rotatable pressure plate assembly positioned in rotatable contact with a turntable assembly supported polishing pad, the turntable assembly having internal fluid cooling means, the wafer polishing temperature control being achieved through responsive closed loop electromechanical means activated by variation of polishing pressure upon the wafers and the polishing pad.
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