A solder station for production dipping of small parts equipped with an automatic dross removal arrangement which consists of a vertically oriented skimmer motor positioned above the solder pot with a long drive shaft extending vertically downward to the pot and a rotating skimmer blade attached to the drive shaft. The skimmer blade rotates slowly and ejects the dross from the top of the solder pot from where it drops down onto a unique sloping dross tray and into a trough from where it may be readily removed. The solder station may be equipped with a forced air filtering system that draws the fumes from the solder pot through a removable filter and expels the filtered air through louvered openings through ducts to the outside. The skimmer motor may be equipped with a friction clutch that prevents damage to the motor in case the rotation of the skimmer should be obstructed. The solder station may have an auxilliary power outlet and thermostatic control of the solder pot temperature. The solder station may also have leg extenders for improved stability and built-in illumination of the work surface.