A solderless filtered connector is formed by a first insulative housing which is selectively plated with conductive material and is profiled to receive therein a second insulative housing carrying a plurality of filtered terminals in a spaced array. Ground is established by a multi-apertured grounding member which receives the respective filter sleeves therein and is profiled to make wiping engagement with the plated portion of the first housing. A metal shell secured to the first housing defines a mating face for the connector and completes the ground path. Each terminal has a compliant intermediate portion which is received in the bore of a respective filter sleeve to make solderless engagement therewith.