A solventless, fluid epoxy resin composition is storage-stable against separation of phases for at least one year, and when cured provides adhesive bonds of improved peel strength at room and low temperatures without loss of lap shear strength at room and elevated temperatures. The composition comprises an epoxide group-containing compound having in situ polymerized, elastomeric particles colloidally dispersed therein, and as curing agent a poly(oxyhydrocarbolene)diamine compound and optionally, and preferably, a cure accelerator.