- 专利标题: Modified epoxy resin and composition
-
申请号: US583793申请日: 1984-03-01
-
公开(公告)号: US4522984A公开(公告)日: 1985-06-11
- 发明人: Shoji Watanabe , Kiyoshi Okitsu
- 申请人: Shoji Watanabe , Kiyoshi Okitsu
- 申请人地址: JPX Osaka
- 专利权人: Daicel Chemical Industries, Ltd.
- 当前专利权人: Daicel Chemical Industries, Ltd.
- 当前专利权人地址: JPX Osaka
- 优先权: JPX56-120507 19810731
- 主分类号: C08G59/00
- IPC分类号: C08G59/00 ; C08G59/14 ; C08G59/16 ; C08G59/62 ; C09D163/00 ; C08L67/04
摘要:
An epoxy resin having hydroxyl groups is modified with .epsilon.-caprolactone by effecting the ring opening polymerization of .epsilon.-caprolactone onto the hydroxyl groups contained in the epoxy resin. The modified epoxy resin is further combined with a polycarboxylic anhydride and a promotor for curing, or polyamine to give a curable composition. The modified epoxy resin is further modified by reacting the epoxy groups therein with a primary or secondary amine. Both the modified resin and the compositions are useful as coating.
公开/授权文献
- US5648614A Integrated circuit and seal 公开/授权日:1997-07-15
信息查询