发明授权
- 专利标题: Heat pump apparatus
- 专利标题(中): 热泵设备
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申请号: US482608申请日: 1983-04-06
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公开(公告)号: US4528823A公开(公告)日: 1985-07-16
- 发明人: Taketoshi Mochizuki , Mituo Kudo , Takao Senshu , Hideyuki Kimura
- 申请人: Taketoshi Mochizuki , Mituo Kudo , Takao Senshu , Hideyuki Kimura
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX57-61051 19820414
- 主分类号: F25B1/10
- IPC分类号: F25B1/10 ; F25B1/00 ; F25B9/00 ; F25B13/00 ; F25B30/02
摘要:
A heat pump apparatus has a main refrigerant circuit constituted by a closed loop including a compressor, condenser, gas-liquid separator, pressure reducer such as an expansion valve, and an evaporator. A shunting refrigerant line having a compressor, condenser and a pressure reducer means shunts from the gaseous phase portion of the gas-liquid separator of the main refrigerant circuit and merges in the evaporator of the main refrigerant circuit. The shunting refrigerant line may be constructed to have one or more compression stages.
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