发明授权
US4546168A Thermosetting resin composition comprising (1) dicyanamide, (2)
polyvalent imide and (3) polymerizable compound
失效
包含（1）二氰胺，（2）多价酰亚胺和（3）可聚合化合物的热固性树脂组合物
- 专利标题： Thermosetting resin composition comprising (1) dicyanamide, (2) polyvalent imide and (3) polymerizable compound
- 专利标题（中）： 包含（1）二氰胺，（2）多价酰亚胺和（3）可聚合化合物的热固性树脂组合物
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申请号： US639092申请日： 1984-08-09
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公开(公告)号： US4546168A公开(公告)日： 1985-10-08
- 发明人: Akio Takahashi , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita
- 申请人： Akio Takahashi , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX56-168787 19811023
- 主分类号： C08G73/00
- IPC分类号： C08G73/00 ; C08G73/06 ; C08G73/12 ; C09D179/08 ; C08G73/10
摘要：
A thermosetting resin composition comprising (A) at least one dicyanamide compound and (B) at least one polyvalent imide having one or more unsaturated bonds and, if necessary (C) at least one polymerizable compound of epoxy compounds, phenolic compounds and triallyl isocyanurate compounds, and a prepolymer thereof obtained by subjecting the composition to a preliminary reaction with heating to the B stage can give a cured product having excellent heat resistance of class C and flexibility.
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