An aromatic polyimide composition usable for producing shaped articles, for example, films, or as varnish, lacquer, or bonding agent, comprises a high molecular weight aromatic polyimide resin which is a polycondensation-imidization product of an aromatic tetracarboxylic acid component comprising 50 molar % or more of 3,4,3',4'-biphenyltetracarboxylic acid, anhydride, salt, or ester with an aromatic diamine component including 50 molar % or more of 4,4'-diaminodiphenylether, and which is dissolved in a mixed solvent consisting essentially of 10% by weight or more of a first solvent component selected from naphthol and resorcin and the balance of a second solvent component selected from phenol and cresols.