发明授权
- 专利标题： Resin encapsulation type semiconductor device
- 专利标题（中）： 树脂封装型半导体器件
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申请号： US580299申请日： 1984-02-21
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公开(公告)号： US4572853A公开(公告)日： 1986-02-25
- 发明人: Hirotoshi Ikeya , Shuichi Suzuki , Takayuki Oguni , Kazutaka Matsumoto , Akiko Hatanaka
- 申请人： Hirotoshi Ikeya , Shuichi Suzuki , Takayuki Oguni , Kazutaka Matsumoto , Akiko Hatanaka
- 申请人地址： JPX Kawasaki
- 专利权人： Tokyo Shibaura Denki Kabushiki Kaisha
- 当前专利权人： Tokyo Shibaura Denki Kabushiki Kaisha
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX55-74943 19800605; JPX56-68374 19810508
- 主分类号： C08G59/62
- IPC分类号： C08G59/62 ; C08G59/68 ; C08L63/00 ; H01L23/29 ; B32B27/38 ; H01B7/08
摘要：
There is presented a highly reliable resin encapsulation type semiconductor device excellent in humidity resistance as well as high temperature electrical characteristics. The specific feature consists in the epoxy resin composition employed for encapsulation. This composition comprises an epoxy resin, a novolac resin as curing agent and an organic tertiary phosphine compound as curing accelerator. The resin encapsulation type semiconductor device is markedly small in leak current under hot and humid conditions and has a prolonged life due to difficult deterioration through corrosion of electrodes and aluminum wiring, as compared with those of prior art.
公开/授权文献
- US5777301A Relay driving apparatus for microwave oven and method thereof 公开/授权日：1998-07-07
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