Electrical lead frames are stamped from a strip of metal, each of the lead frames including spaced metal strips extending between carrier members. Projections extend outwardly from the metal strips. A dielectric housing is molded onto each of the lead frames and includes recesses in one surface exposing respective projections and holes extending through the housing in communication with the respective projections so that the electrical leads of electronic components and electrical wires can be inserted into the holes in electrical engagement with the projections and secured therein by the projections.