发明授权
- 专利标题: Paste for forming a thick conductive film
- 专利标题(中): 用于形成厚导电膜的糊状物
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申请号: US754215申请日: 1985-07-12
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公开(公告)号: US4603007A公开(公告)日: 1986-07-29
- 发明人: Koushiro Shibata , Tohru Miyoshi , Isamu Hiraoka , Takeshi Shimomoto
- 申请人: Koushiro Shibata , Tohru Miyoshi , Isamu Hiraoka , Takeshi Shimomoto
- 申请人地址: JPX Tokyo JPX Osaka
- 专利权人: Sumitomo Metal Mining Company Limited,Shimomoto Giken Co., Ltd.
- 当前专利权人: Sumitomo Metal Mining Company Limited,Shimomoto Giken Co., Ltd.
- 当前专利权人地址: JPX Tokyo JPX Osaka
- 优先权: JPX145382 19840713
- 主分类号: C03C3/108
- IPC分类号: C03C3/108 ; H01B1/16 ; H01C17/065 ; H01B1/06
摘要:
A paste for forming a thick electrically conductive film, which may, for example, be used to produce a touch panel for an electric appliance, contains 40 to 55% by weight of lead borosilicate glass powder containing 1 to 5% by weight of titanium oxide, a total of 15 to 35% by weight of ruthenium oxide powder and silver and/or palladium powder, 1 to 5% by weight of bismuth oxide powder and 1 to 5% by weight of alumina powder in an organic vehicle.
公开/授权文献
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